The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5° C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.