Invention Grant
- Patent Title: Copper alloy wire
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Application No.: US14890116Application Date: 2014-05-22
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Publication No.: US10584400B2Publication Date: 2020-03-10
- Inventor: Yasuhiro Tsugawa , Toshio Sakamoto
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2013-110079 20130524; JP2014-068368 20140328
- International Application: PCT/JP2014/063564 WO 20140522
- International Announcement: WO2014/189103 WO 20141127
- Main IPC: C22C9/06
- IPC: C22C9/06 ; B22D11/00 ; C22C9/02 ; C22F1/08 ; B22D21/00

Abstract:
This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.
Public/Granted literature
- US20160122849A1 COPPER ALLOY WIRE Public/Granted day:2016-05-05
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