Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15420352Application Date: 2017-01-31
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Publication No.: US10584416B2Publication Date: 2020-03-10
- Inventor: Hitoshi Kato , Yukio Ohizumi , Manabu Honma , Takeshi Kobayashi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2016-018314 20160202; JP2016-231407 20161129
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/687 ; C23C16/458 ; C23C16/40 ; C23C16/455 ; C23C16/44

Abstract:
A substrate processing apparatus includes a mounting stand installed to rotate about a rotation shaft extending along a rotary shaft of a rotary table and configured to hold a substrate, and a magnetic gear mechanism including a driven gear configured to rotate the mounting stand about the rotation shaft and a driving gear configured to drive the driven gear. The driven gear is connected to the mounting stand via the rotation shaft and installed to rotate in such a direction as to rotate the mounting stand. The driving gear is disposed in a state in which the driving surface faces the driven surface passing through a predetermined position on a movement orbit of the driven gear moving along with the rotation of the rotary table.
Public/Granted literature
- US20170218514A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-08-03
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