A cooling device with small structured rib-dimple hybrid structures, comprising a substrate, a cooling channel, a plurality of small structured ribs and a plurality of dimples. The cooling channel, the plurality of small structured ribs and the plurality of dimples are all disposed on the wall surface of the substrate; the plurality of dimples are in a staggered arrangement or in a longitudinal arrangement, forming a dimple array; an upstream wall surface of each dimple or a plurality of dimples is provided with the small structured ribs, thus forming an small structured rib-dimple hybrid structure.