- Patent Title: Imprint apparatus and method of manufacturing semiconductor device
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Application No.: US16051529Application Date: 2018-08-01
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Publication No.: US10585349B2Publication Date: 2020-03-10
- Inventor: Satoshi Usui
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2018-018613 20180205
- Main IPC: H01L21/027
- IPC: H01L21/027 ; G03F7/00 ; B41M3/00 ; B41J2/045 ; G03F7/16

Abstract:
According to one embodiment, an imprint apparatus includes: an ejection unit that ejects droplets of a resin-based mask material on a substrate on the basis of a droplet dropping condition; and a control unit that selects a first droplet dropping condition according to a pattern to be transferred to the resin-based mask material and a second droplet dropping condition according to an underlying step difference amount that is concave-convex of a first shot area and causes the ejection unit to eject the droplets with respect to the first shot area, wherein the shot area where a pattern is formed on the substrate by one time of imprinting is set.
Public/Granted literature
- US20190243235A1 IMPRINT APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-08-08
Information query
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