Invention Grant
- Patent Title: Hinge assemblies
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Application No.: US16348626Application Date: 2017-02-03
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Publication No.: US10585459B2Publication Date: 2020-03-10
- Inventor: Wei-Chung Chen , Kuan-Ting Wu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2017/016358 WO 20170203
- International Announcement: WO2018/144001 WO 20180809
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02 ; F16C11/04

Abstract:
Examples of hinge assemblies for a chassis of electronic devices and foldable devices are described. In one example, a hinge assembly comprises a set of rolling members aligned along a folding axis of a device implementing the hinge assembly. The set of rolling members is movable along a curvature of the device when the device is folded and retracted. The hinge assembly further comprises a resilient member to couple the set of rolling members to a sliding member provided within the chassis of the device. The sliding member is movable along a surface of the chassis, and the resilient member is to pull and retract the sliding member towards the folding axis based on the movement of the set of rolling members.
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