A film touch sensor includes a separating layer, an electrode pattern layer including a sensing electrode disposed on the separating layer and a pad electrode disposed at one end of the sensing electrode, a circuit board connected to the pad electrode, and a base film formed on the sensing electrode and a pad area of the circuit board. The film touch sensor may be fabricated by forming a separating layer on a carrier substrate, forming an electrode pattern layer including a sensing electrode and a pad electrode on the separating layer, connecting a circuit board to the pad electrode, forming a base film on the electrode pattern layer and the circuit board, and peeling-off the separating layer from the carrier substrate.