Invention Grant
- Patent Title: Multi-dimensional placement
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Application No.: US15662617Application Date: 2017-07-28
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Publication No.: US10586007B1Publication Date: 2020-03-10
- Inventor: Ron Bigman
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Daly, Crowley Mofford & Durkee, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H03M7/30 ; G06F3/06

Abstract:
A multi-dimensional placement methodology, system and computer readable medium is presented. A plurality of data sets is ordered by need. A plurality of storage areas are defined based on a storage device type, an associated compression algorithm, and a plurality of parameters associated with different properties of the particular storage device and the compression algorithm being used. A data set is placed in a selected storage area based on a determination of which storage area provides a desired combination of the storage device type and compression.
Public/Granted literature
- US1373083A Connecting-rod Public/Granted day:1921-03-29
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