Invention Grant
- Patent Title: Copper alloy wire rod
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Application No.: US16235935Application Date: 2018-12-28
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Publication No.: US10586626B2Publication Date: 2020-03-10
- Inventor: Shigeki Sekiya , Kengo Mitose
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Dorsey & Whitney LLP
- Priority: JP2016-234460 20161201
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B13/00 ; C22F1/08 ; C22C9/00 ; C22F1/00

Abstract:
A copper alloy wire rod having an alloy composition containing 0.5 to 6.0% by mass of Ag, 0 to 1.0% by mass of Mg, 0 to 1.0% by mass of Cr, and 0 to 1.0% by mass of Zr, with the balance being Cu and inevitable impurities, wherein an average closest particle distance of second phase particles having a particle size of 200 nm or less is 580 nm or less in a cross section perpendicular to a longitudinal direction of the wire rod.
Public/Granted literature
- US20190139669A1 COPPER ALLOY WIRE ROD Public/Granted day:2019-05-09
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