Invention Grant
- Patent Title: Wire harness
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Application No.: US15837053Application Date: 2017-12-11
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Publication No.: US10586630B2Publication Date: 2020-03-10
- Inventor: Hidetoshi Sugino
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, LTD.
- Current Assignee: Sumitomo Wiring Systems, LTD.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Reising Ethington, P.C.
- Priority: JP2016-252352 20161227
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/18 ; H02G3/04

Abstract:
A wire harness that allows branched locations to be defined and can be manufactured inexpensively. A wire harness includes a tubular bendable pipe through which a wire is inserted. The pipe includes pull-out ports of the wire at positions corresponding to branching locations of the wire. The pull-out ports are configured to open on the respective mating surfaces of a first divided segment and a second divided segment obtained by circumferentially dividing the pipe into two. Bushes serving as protection portions that protect the wire are provided at rims of the pull-out ports.
Public/Granted literature
- US20180182509A1 WIRE HARNESS Public/Granted day:2018-06-28
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