Invention Grant
- Patent Title: Chip resistor and mounting structure thereof
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Application No.: US16371885Application Date: 2019-04-01
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Publication No.: US10586635B2Publication Date: 2020-03-10
- Inventor: Masaki Yoneda
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2013-124894 20130613; JP2013-124895 20130613; JP2013-146847 20130712
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C1/142 ; H01C1/028 ; H01C3/12 ; H01C1/014 ; H01C1/14 ; H05K3/34 ; H05K1/18

Abstract:
A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
Public/Granted literature
- US20190228886A1 CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF Public/Granted day:2019-07-25
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