Invention Grant
- Patent Title: Electronic component
-
Application No.: US15708231Application Date: 2017-09-19
-
Publication No.: US10586647B2Publication Date: 2020-03-10
- Inventor: Yasushi Takeda
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2016-187174 20160926
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/32 ; H01F41/04

Abstract:
An electronic component includes an element assembly that includes a magnetic layer and a non-magnetic layer and a coil that is provided within the element assembly and that is wound in a spiral form. The coil includes a plurality of laminated layers of coil wires. The non-magnetic layer includes an inter-wire non-magnetic layer located between at least one pair of the coil wires that are adjacent in a lamination direction and a radial direction non-magnetic layer located on at least one of an outer side portion and an inner side portion in a radial direction of the coil. The radial direction non-magnetic layer is spaced apart from the inter-wire non-magnetic layer.
Public/Granted literature
- US20180090261A1 ELECTRONIC COMPONENT Public/Granted day:2018-03-29
Information query