Invention Grant
- Patent Title: Method and apparatus for reproducing component of semiconductor manufacturing apparatus, and reproduced component
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Application No.: US15394491Application Date: 2016-12-29
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Publication No.: US10586687B2Publication Date: 2020-03-10
- Inventor: Ki Won Kim , Hyeong Uk Roh , Jong Sung Yun , Won Pyo Hong
- Applicant: TOKAI CARBON KOREA CO., LTD
- Applicant Address: KR
- Assignee: TOKAI CARBON KOREA CO., LTD.
- Current Assignee: TOKAI CARBON KOREA CO., LTD.
- Current Assignee Address: KR
- Agency: Hayes Soloway P.C.
- Priority: KR10-2016-0064388 20160525
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/02 ; C23C16/56 ; C23C16/04 ; C23C16/44
Abstract:
A method and apparatus for reproducing a component of a semiconductor manufacturing apparatus, and a reproduced component are provided. The method may include a preparing step of preparing a damaged component of a semiconductor manufacturing apparatus, a first cleaning step of cleaning the damaged component, a masking step of masking at least one of areas including an undamaged part of the damaged component, a reproduced part forming step of forming a reproduced part on the damaged component using a chemical vapor deposition (CVD), a post-grinding step of grinding the damaged component with the reproduced part, and a second cleaning step of cleaning the damaged component with the reproduced part.
Public/Granted literature
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