Invention Grant
- Patent Title: Method of assessing semiconductor substrate and method of assessing device chip
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Application No.: US16129274Application Date: 2018-09-12
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Publication No.: US10586699B2Publication Date: 2020-03-10
- Inventor: Youngsuk Kim , Shoichi Kodama
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2017-176095 20170913
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; H01L21/02 ; H01L21/268 ; H01L21/66 ; G01R31/28 ; G01R31/26 ; G01R31/311
Abstract:
A method of assessing a semiconductor substrate includes a sticking step of sticking a device layer of the semiconductor substrate to a support substrate, a thinning step of thinning the semiconductor substrate from a reverse side thereof to a thickness smaller than a finished thickness after the sticking step is carried out, and an assessing step of applying light to the semiconductor substrate from the reverse side thereof and measuring scattered light from the semiconductor substrate thereby to assess a property of the semiconductor substrate.
Public/Granted literature
- US20190080905A1 METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING DEVICE CHIP Public/Granted day:2019-03-14
Information query
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