Invention Grant
- Patent Title: Via cleaning to reduce resistance
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Application No.: US15198075Application Date: 2016-06-30
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Publication No.: US10586732B2Publication Date: 2020-03-10
- Inventor: Yann A. M. Mignot , Chih-Chao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/02 ; H01L23/522 ; H01L23/532
Abstract:
A method includes forming at least a first via in a multilayer structure comprising a first layer and a second layer formed over the first layer, the first via extending from a top of the second layer to a top of a first contact formed in the first layer and forming a polymer film on at least a portion of sidewalls of the first via by etching the top of the first contact using a cleaning process.
Public/Granted literature
- US20180005874A1 VIA CLEANING TO REDUCE RESISTANCE Public/Granted day:2018-01-04
Information query
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