Invention Grant
- Patent Title: Airtight package and method for manufacturing same
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Application No.: US16090824Application Date: 2017-02-20
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Publication No.: US10586745B2Publication Date: 2020-03-10
- Inventor: Takuji Oka , Koichi Yabuuchi , Toru Shiragami
- Applicant: NIPPON ELECTRIC GLASS CO., LTD.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Keating and Bennett, LLP
- Priority: JP2016-128838 20160629
- International Application: PCT/JP2017/006086 WO 20170220
- International Announcement: WO2018/003164 WO 20180104
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/10 ; H01L23/08 ; H01L33/48 ; H01L21/50 ; H01L21/48

Abstract:
Provided are an airtight package that can increase the bonding strength between the sealing material layer and the container and a method for manufacturing the same. An airtight package 1 includes: a container 2 with a frame 3; a glass lid 4 disposed on top of the frame 3 and sealing the container 2; and a sealing material layer 5 disposed between the frame 3 and the glass lid 4 and bonding the glass lid 4 and the container 2 together, wherein in the sealing material layer 5 a bonding surface 5b between the sealing material layer 5 and the container 2 is larger than a bonding surface 5a between the sealing material layer 5 and the glass lid 4.
Public/Granted literature
- US20190096778A1 AIRTIGHT PACKAGE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-03-28
Information query
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