Invention Grant
- Patent Title: Printed circuit board and semiconductor package
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Application No.: US15402876Application Date: 2017-01-10
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Publication No.: US10586748B2Publication Date: 2020-03-10
- Inventor: Soo-Jae Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0049384 20160422
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/31 ; H01L23/00 ; H01L21/683

Abstract:
A printed circuit board (PCB) includes an insulating layer with an upper surface and a lower surface opposite to the upper surface; a first conductive pattern on the upper surface of the insulating layer; a second conductive pattern on the lower surface of the insulating layer; an aluminum pattern that covers at least a portion of an upper surface of the first conductive pattern; and a first passivation layer that covers at least a portion of sides of the first conductive pattern and that prevents diffusion into the first conductive pattern.
Public/Granted literature
- US20170309559A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE Public/Granted day:2017-10-26
Information query
IPC分类: