The present invention relates to a stackable power module, comprising a module body having a top side and a bottom side provided with top and bottom contact pads, each of the top contact pads electrically connected to a corresponding bottom contact pad; at least one power semiconductor device embedded in the module body, at least one conductive structure connecting the power semiconductor device to a respective top and/or bottom contact pad, wherein the at least one conductive structure has a thermal capacity sufficient to take up an amount of heat generated during a switching cycle of the at least one power semiconductor device without increasing temperature above a critical threshold.