Invention Grant
- Patent Title: Substrate-with-support
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Application No.: US16216152Application Date: 2018-12-11
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Publication No.: US10586758B2Publication Date: 2020-03-10
- Inventor: Tetsuichiro Kasahara
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2018-003323 20180112
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H01L23/49 ; H01L23/495 ; H01L23/00 ; H01L23/498 ; H01L21/56 ; H01L23/31

Abstract:
A substrate-with-support includes: a substrate having a wiring area, an outer peripheral area provided on an outer peripheral side of the wiring area, and a plurality of support joint portions being provided on the outer peripheral area; and a support made of metal having an outer frame portion arranged to face the outer peripheral area and to expose the wiring area, and a plurality of protruding portions being provided on the outer frame portion, wherein the support joint portions and the protruding portions are joined to each other.
Public/Granted literature
- US20190221505A1 SUBSTRATE-WITH-SUPPORT Public/Granted day:2019-07-18
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