Invention Grant
- Patent Title: Semiconductor package and fabricating method thereof
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Application No.: US15832027Application Date: 2017-12-05
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Publication No.: US10586761B2Publication Date: 2020-03-10
- Inventor: Keun Soo Kim , Jae Yun Kim , Byoung Jun Ahn , Dong Soo Ryu , Dae Byoung Kang , Chel Woo Park
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0017324 20150204
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L25/10 ; H01L23/42 ; H01L23/433 ; H01L23/538
Abstract:
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
Public/Granted literature
- US20180096928A1 SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF Public/Granted day:2018-04-05
Information query
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