Invention Grant
- Patent Title: Conductive shield for semiconductor package
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Application No.: US14571036Application Date: 2014-12-15
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Publication No.: US10586771B2Publication Date: 2020-03-10
- Inventor: Saravuth Sirinorakul , Somchai Nondhasitthichail
- Applicant: UTAC Thai Limited
- Applicant Address: SG Singapore
- Assignee: UTAC HEADQUARTERS PTE, LTD
- Current Assignee: UTAC HEADQUARTERS PTE, LTD
- Current Assignee Address: SG Singapore
- Agency: Haverstock & Owens LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/78 ; H01L23/60 ; H01L23/552 ; H01L23/00 ; H01L23/31 ; H01L21/683
Abstract:
A conductive polymer shielding layer covering insulating layer formed on an integrated-circuit die is provided and a method thereof. The method comprises die attaching, wire bonding, back etching, insulation molding, partial cutting, conductive material/polymer coating, and singulation.
Public/Granted literature
- US20150171022A1 CONDUCTIVE SHIELD FOR SEMICONDUCTOR PACKAGE Public/Granted day:2015-06-18
Information query
IPC分类:
