Provided is a semiconductor device having a single inline package with high vibration resistance. External terminals (2a to 2c) are extracted from a resin encapsulation body (3) including a magnetic sensor and other semiconductor elements, a resin protruded portion is formed between the external terminal and the adjacent external terminal, and a gap is formed between the resin protruded portion and the external terminal. When the semiconductor device is mounted on a mounting substrate, the resin protruded portion is fixed on a surface of the mounting substrate, and the external terminal is bonded to a hole formed in the mounting substrate.