Invention Grant
- Patent Title: Elastic wave element and elastic wave apparatus
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Application No.: US16150354Application Date: 2018-10-03
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Publication No.: US10586778B2Publication Date: 2020-03-10
- Inventor: Kenichi Uesaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-079138 20160411
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H03H9/10 ; H03H9/05 ; H03H9/25 ; H01L23/28 ; H01L23/498 ; H01L23/538 ; H01L41/09 ; H01L41/25

Abstract:
An elastic wave element includes a vibrator, an electrode pad, a UBM portion including a first end surface joined to the electrode pad, and a bump joined to a second end surface of the UBM portion. Joint terminals are defined by joining the electrode pad, the UBM portion, and the bump. A shortest distance between a specified joint terminal and remaining joint terminals is an inter-bump distance of the specified joint terminal. Second end surfaces of first and second joint terminal have areas greater than areas of second end surfaces of remaining joint terminals. The inter-bump distance of the first joint terminal is longer than the shortest inter-bump distance of the joint terminals and is the longest of the inter-bump distances. The second joint terminal is spaced the longest inter-bump distance from the first joint terminal.
Public/Granted literature
- US20190035754A1 ELASTIC WAVE ELEMENT AND ELASTIC WAVE APPARATUS Public/Granted day:2019-01-31
Information query
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