Invention Grant
- Patent Title: Circuit arrangement having semiconductor switches
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Application No.: US16250687Application Date: 2019-01-17
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Publication No.: US10586796B2Publication Date: 2020-03-10
- Inventor: Rolf Weis
- Applicant: Infineon Technologies Dresden GmbH & CO. KG
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH & Co. KG
- Current Assignee: Infineon Technologies Dresden GmbH & Co. KG
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H03K17/10

Abstract:
A circuit has first and second semiconductor switches, each of which has a load path and control terminal connected in series. Each switch includes a first semiconductor device having a load path and a control terminal coupled to the control terminal of its switch, and a second semiconductor device having a load path between first and second load terminals, and a control terminal. Each second semiconductor device has its load path connected in series to the load path of the corresponding first semiconductor device. The semiconductor devices are coupled such that the second semiconductor devices are controlled by a load path voltage of the first semiconductor devices. The switches are integrated in a common semiconductor body. The first switch is implemented in a first area of the semiconductor body, and the second switch is implemented in a second area. In a horizontal plane, the first area surrounds the second area.
Public/Granted literature
- US20190157266A1 Circuit Arrangement Having Semiconductor Switches Public/Granted day:2019-05-23
Information query
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