3D NAND memory cells can include a source layer, a dielectric layer disposed on the source layer, and a select gate source (SGS) layer disposed on the dielectric layer. A plurality of alternating layers of conducting material and insulating material can be disposed on the SGS layer. A conductive channel can be formed within a cell pillar trench. The conductive channel can be in contact with the source layer and the plurality of alternating layers. The cell pillar trench can be positioned in a substantially perpendicular orientation with respect to the plurality of alternating layers.