Invention Grant
- Patent Title: SOI substrate compatible with the RFSOI and FDSOI technologies
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Application No.: US16003199Application Date: 2018-06-08
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Publication No.: US10586810B2Publication Date: 2020-03-10
- Inventor: Yann Lamy , Lamine Benaissa , Etienne Navarro
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1755314 20170613
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L27/12 ; H01L29/06 ; H01L21/84 ; H01L21/324 ; H01L21/268 ; H01L21/763 ; H01L21/762 ; H01L21/02

Abstract:
A semiconductor on insulator type substrate, comprising at least: a support layer; a semiconductor surface layer; a buried dielectric layer located between the support layer and the semiconductor surface layer; a trap rich layer located between the buried dielectric layer and the support layer, and comprising at least one polycrystalline semiconductor material and/or a phase change material; in which the trap rich layer comprises at least one first region and at least one second region adjacent to each other in the plane of the trap rich layer, the material of the at least one first region being in an at least partially recrystallized state and having an electrical resistivity less than that of the material in the at least one second region.
Public/Granted literature
- US20180358381A1 SOI SUBSTRATE COMPATIBLE WITH THE RFSOI AND FDSOI TECHNOLOGIES Public/Granted day:2018-12-13
Information query
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