Invention Grant
- Patent Title: Image pickup device, method of manufacturing image pickup device, and electronic apparatus
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Application No.: US15354722Application Date: 2016-11-17
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Publication No.: US10586821B2Publication Date: 2020-03-10
- Inventor: Yuki Miyanami
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2013-138264 20130701
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146 ; H04N5/357 ; H04N5/374

Abstract:
An image pickup device includes: a photodiode provided in a silicon substrate, and configured to generate electric charge corresponding to an amount of received light, by performing photoelectric conversion; and a transfer transistor provided at an epitaxial layer on the silicon substrate, and configured to transfer the electric charge generated in the photodiode, wherein the transfer transistor includes a gate electrode and a channel region, the gate electrode being embedded in the epitaxial layer, and the channel region surrounding the gate electrode, and the channel region has, in a thickness direction, a concentration gradient in which a curvature of a potential gradient is free from a mixture of plus and minus signs.
Public/Granted literature
- US20170069674A1 IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2017-03-09
Information query
IPC分类: