Invention Grant
- Patent Title: Handle for semiconductor-on-diamond wafers and method of manufacture
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Application No.: US15832718Application Date: 2017-12-05
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Publication No.: US10586850B2Publication Date: 2020-03-10
- Inventor: Quentin Diduck , Daniel Francis , Frank Yantis Lowe , Felix Ejeckam
- Applicant: RFHIC Corporation
- Applicant Address: KR Anyang-si
- Assignee: RFHIC Corporation
- Current Assignee: RFHIC Corporation
- Current Assignee Address: KR Anyang-si
- Agency: Patent Office of Dr. Chung Park
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/20 ; H01L21/02 ; H01L23/373 ; H01L21/683 ; H01L29/165 ; H01L23/00
Abstract:
Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers to a carrier are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.
Public/Granted literature
- US20180108739A1 HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE Public/Granted day:2018-04-19
Information query
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