Invention Grant
- Patent Title: LED package
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Application No.: US16162745Application Date: 2018-10-17
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Publication No.: US10586897B2Publication Date: 2020-03-10
- Inventor: Seunghyun Oh , Sungsik Jo , Byeonggeon Kim
- Applicant: LUMENS CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: LUMENS CO., LTD.
- Current Assignee: LUMENS CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Mei & Mark LLP
- Priority: KR10-2017-0146590 20171106
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/64 ; H01L33/60 ; H01L33/48

Abstract:
An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.
Public/Granted literature
- US20190140147A1 LED PACKAGE Public/Granted day:2019-05-09
Information query
IPC分类: