Invention Grant
- Patent Title: Resin package and light-emitting device
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Application No.: US16198154Application Date: 2018-11-21
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Publication No.: US10586905B2Publication Date: 2020-03-10
- Inventor: Yuta Horikawa , Takuya Miki , Shoichi Ishikawa , Ryosuke Wakaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2017-228484 20171129
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/48 ; H01L23/49 ; H01L25/075 ; H01L23/495 ; H01L23/498

Abstract:
A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.
Public/Granted literature
- US20190165233A1 RESIN PACKAGE AND LIGHT-EMITTING DEVICE Public/Granted day:2019-05-30
Information query
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