Invention Grant
- Patent Title: Wiring module
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Application No.: US15175349Application Date: 2016-06-07
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Publication No.: US10586970B2Publication Date: 2020-03-10
- Inventor: Kazuto Sugiyama , Masahide Tsuru
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2015-117168 20150610
- Main IPC: H01M2/00
- IPC: H01M2/00 ; H01M2/02 ; H01M2/20 ; H01M2/30 ; H01M2/34

Abstract:
A wiring module that is used in a battery assembly in which a columnar positive electrode and a columnar negative electrode of a plurality of batteries formed in a thin-type rectangular parallelepiped shape are arranged alternately. The wiring module includes a terminal pattern on a surface of an insulating resin substrate connected to the columnar positive electrode and the columnar negative electrode; a voltage detection wiring pattern on the surface connected to the terminal pattern; a fuse pattern on the surface interposed in the voltage detection wiring pattern; and an insulating resin layer that covers a peripheral portion of the terminal pattern, the voltage detection wiring pattern, and the fuse pattern are covered with the insulating resin layer A pair of through-holes, into which the columnar positive electrode and the columnar negative electrode are inserted, is formed in the terminal pattern and the insulating resin substrate.
Public/Granted literature
- US20160365562A1 WIRING MODULE Public/Granted day:2016-12-15
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