Invention Grant
- Patent Title: Fully integrated broadband interconnect
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Application No.: US15882771Application Date: 2018-01-29
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Publication No.: US10587026B2Publication Date: 2020-03-10
- Inventor: Jack W. Holloway , Ruonan Han
- Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
- Applicant Address: US DC Washington
- Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
- Current Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US DC Washington
- Agency: US Naval Research Laboratory
- Agent Roy Roberts
- Main IPC: H01P5/08
- IPC: H01P5/08 ; H01P5/02 ; H01P3/16 ; H01L23/15 ; H01L23/532 ; H01L23/522 ; H01Q13/22

Abstract:
Embodiments herein relate to a fully integrated broadband interconnect. The system comprises a first integrated circuit, a second integrated circuit, and a coupler structure to connect the first and second integrated circuits, where the coupler structure includes a base portion and a top portion that are connected by two vertical walls. The top portion has a gap that increases a strength of a transverse electric field across the gap when the coupler structure is operating in an odd higher order mode that is horizontally polarized, where the coupler structure is full of a dielectric material, and where the cross-sectional width of the coupler structure is tapered in a direction of wave propagation. The system further comprises a dielectric waveguide attached to the top portion of the coupler structure, where the dielectric waveguide supports the odd higher order mode and an even higher order mode.
Public/Granted literature
- US20180219270A1 FULLY INTEGRATED BROADBAND INTERCONNECT Public/Granted day:2018-08-02
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