In the conductor crimping portion (3), side portions (3a, 3b) are folded into a bottom layer plate (3c) and a top layer plate (3d), and edges of the side portions (3a, 3b) are abutted against each other to form a joint (3g).Additionally, three long groove-like punched long holes (3i to 3k), for example, are provided in an oblique direction with respect to a longitudinal direction of the crimp connection terminal in a bottom portion (3h) of the top layer plate (3d). A shallow round recessed portion (3l) is formed in the surface of the punched long hole (3i) by stamping. Edges (3m) of this recessed portion (3l) and new edges (3n′) formed by edges (3n) of the punched long hole (3i), obtained by the punching, being pushed inward by the stamping are formed in two steps.