An electrical connector used to be electrically connected to a chip module includes a body provided with multiple accommodating holes running through the body and at least one accommodating grooves. Each accommodating groove is formed between two adjacent accommodating holes to communicate the two adjacent accommodating holes with each other. Multiple terminals are correspondingly accommodated in the accommodating holes respectively. Each terminal includes a base and an elastic portion bending and extending upward from the base, and the elastic portion upward abuts the chip module. Each accommodating groove correspondingly accommodates the base of one of the terminals. Each accommodating groove is used for lowering strength of the body. When the electrical connector is soldered to a circuit board by high-temperature heating, the body is prone to be softened under the high temperature and thus becomes smooth, such that warping occurring during forming of the body is eliminated.