Invention Grant
- Patent Title: Temperature compensated acoustic resonator device having thin seed interlayer
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Application No.: US15084278Application Date: 2016-03-29
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Publication No.: US10587241B2Publication Date: 2020-03-10
- Inventor: Qiang Zou , Chris Feng , John Choy
- Applicant: Avago Technologies International Sales Pte. Limited
- Applicant Address: SG Singapore
- Assignee: Avago Technologies International Sales Pte. Limited
- Current Assignee: Avago Technologies International Sales Pte. Limited
- Current Assignee Address: SG Singapore
- Agency: Sheridan Ross P.C.
- Main IPC: H01L41/18
- IPC: H01L41/18 ; H03H9/02 ; H03H9/17 ; H03H9/13

Abstract:
An acoustic resonator device includes a composite first electrode disposed over a substrate; a piezoelectric layer disposed on the composite first electrode, the piezoelectric layer including a piezoelectric material doped with scandium for improving piezoelectric properties; and a second electrode disposed on the piezoelectric layer. The composite first electrode includes a base electrode layer disposed over the substrate; a temperature compensation layer disposed on the base electrode layer; a seed interlayer disposed on the temperature compensation layer, the seed interlayer having a thickness between about 5Å and about 150Å; and a conductive interposer layer disposed on at least the seed interlayer, at least a portion of the conductive interposer layer contacting the base electrode layer. The piezoelectric layer has a negative temperature coefficient and the temperature compensation layer has a positive temperature coefficient at least partially offsetting the negative temperature coefficient.
Public/Granted literature
- US20170288636A1 TEMPERATURE COMPENSATED ACOUSTIC RESONATOR DEVICE HAVING THIN SEED INTERLAYER Public/Granted day:2017-10-05
Information query
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