Invention Grant
- Patent Title: Saw filter device and method of manufacturing the same
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Application No.: US15480841Application Date: 2017-04-06
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Publication No.: US10587243B2Publication Date: 2020-03-10
- Inventor: Jang Ho Park
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2016-0100668 20160808
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H3/08 ; H01L41/047 ; H01L41/29

Abstract:
A surface acoustic wave (SAW) filter device includes: a first layer disposed on a substrate; an inter-digital transducer (IDT) electrode layer disposed on the first layer; a second layer covering the IDT electrode layer and the first layer; and an overlay layer covering the second layer, wherein the first layer includes any one or any combination of any two or more of a metal layer, a metal oxide layer, and an oxide layer.
Public/Granted literature
- US20180041191A1 SAW FILTER DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-02-08
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