Invention Grant
- Patent Title: Load drive apparatus
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Application No.: US16469537Application Date: 2017-11-06
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Publication No.: US10587263B2Publication Date: 2020-03-10
- Inventor: Takahiro Kawata , Yoichiro Kobayashi , Mitsuhiko Watanabe
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Volpe and Koenig, P.C.
- Priority: JP2016-242287 20161214
- International Application: PCT/JP2017/039863 WO 20171106
- International Announcement: WO2018/110141 WO 20180621
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H03K17/687 ; G01R31/26 ; H01L27/12 ; H02M7/48 ; H01L21/76 ; H01L27/04 ; H01L21/762 ; H01L21/822 ; H02P25/04 ; H02P27/06

Abstract:
Provided are a load drive apparatus in which a semiconductor chip using DTI for inter-element separation is mounted, the load drive apparatus being capable of diagnosing a dielectric strength voltage of the DTI and highly reliable and a failure diagnosis method of the load drive apparatus. There is provided a load drive apparatus in which a semiconductor chip is mounted. The semiconductor chip includes a load drive output unit formed on a semiconductor substrate. The load drive output unit has a first region where an MOSFET that controls load driving is formed and a second region insulated and separated by DTI from the first region and includes a first leakage current detection element provided in the first region, a second leakage current detection element provided in the second region, and a failure detection unit that determines a failure of the load drive output unit.
Public/Granted literature
- US20190305772A1 LOAD DRIVE APPARATUS Public/Granted day:2019-10-03
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