Invention Grant
- Patent Title: Preparation method of flexible transparent circuit
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Application No.: US16031088Application Date: 2018-07-10
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Publication No.: US10588217B2Publication Date: 2020-03-10
- Inventor: Jing Sun , Mingfei Lang
- Applicant: Dalian University
- Applicant Address: CN Dalian
- Assignee: DALIAN UNIVERSITY
- Current Assignee: DALIAN UNIVERSITY
- Current Assignee Address: CN Dalian
- Agency: Hauptman Ham, LLP
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/02 ; H05K1/03 ; H05K3/12 ; H05K1/09

Abstract:
A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.
Public/Granted literature
- US20200022256A1 PREPARATION METHOD OF FLEXIBLE TRANSPARENT CIRCUIT Public/Granted day:2020-01-16
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