An assembly for extracting heat from a housing for electronic equipment, the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing. The chimney encompasses and is in fluid communication with the first and second openings.