A method for drilling a hole in a component is provided. The method includes directing a confined laser beam of the confined laser drill towards a near wall of the component and sensing a characteristic of light directed along a beam axis of the confined laser beam away from the component with a sensor. The method also includes determining one or more operational conditions based on the characteristic of the light sensed with the sensor. The one or more operational conditions includes at least one of a depth of the hole being drilled by the confined laser drill and a material into which the confined laser beam of the confined laser drill is being directed. Such a method may allow for more appropriate control of the confined laser drill.