Invention Grant
- Patent Title: Injection molding method and injection molding device for transparent resin molded article
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Application No.: US14392280Application Date: 2014-08-20
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Publication No.: US10589448B2Publication Date: 2020-03-17
- Inventor: Masahiro Bessho , Naomoto Ishikawa , Tsunetoshi Tanemura
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-204665 20130930
- International Application: PCT/JP2014/071698 WO 20140820
- International Announcement: WO2015/045677 WO 20150402
- Main IPC: B29C45/00
- IPC: B29C45/00 ; B29C45/14 ; B29C45/16 ; B29C45/26 ; B29K33/00 ; B29K69/00 ; B29L9/00 ; B29L31/30

Abstract:
The present invention effects a reduction in production cost and increases yield of a transparent resin molded article and prevents the generation of defects such as bubbles, weld lines, and sink marks. This injection molding device (2A) for a transparent resin molded article is equipped with: a die (3) for injection molding the transparent resin molded article; and a gate (5) that is provided to the peripheral edge of the die (3) and that is the inlet through which a resin material (R) is injected into the die (3). The thickness dimensions (Ta) of the die (3) are in the range of 15-25 mm, and the ratio of the diameter dimensions (D) of the gate (5) to the thickness dimensions (Ta) of the die (3) is set in the range of 1:6 to 1:3.
Public/Granted literature
- US20160263797A1 INJECTION MOLDING METHOD AND INJECTION MOLDING DEVICE FOR TRANSPARENT RESIN MOLDED ARTICLE Public/Granted day:2016-09-15
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