Invention Grant
- Patent Title: Assembling device
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Application No.: US15647247Application Date: 2017-07-11
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Publication No.: US10589472B2Publication Date: 2020-03-17
- Inventor: Tianbo Wang , Xinguang Zhang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE CHATANI ELECTRONICS CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE CHATANI ELECTRONICS CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE CHATANI ELECTRONICS CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201621035737U 20160831
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B29C65/00 ; G02F1/13 ; G02F1/1333 ; B29L12/00 ; B29C65/58 ; B29L31/34

Abstract:
An assembling device is disclosed. The assembling device is used to assemble a plastic frame and a back plate together and includes: a pressing mechanism configured to press a region of the plastic frame; and a supporting device. The supporting device includes: a supporting platform configured to support the back plate and the plastic frame; and a supporting frame configured to support the pressing mechanism. The pressing mechanism is configured to contact the plastic frame at least one contact point, and a direction of a resultant force of forces applied at the at least one contact point by the pressing mechanism is at an acute angle with respect to a plane where a top surface of the plastic frame lies.
Public/Granted literature
- US20180056600A1 ASSEMBLING DEVICE Public/Granted day:2018-03-01
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