Invention Grant
- Patent Title: Multilayer structure, and packaging material formed from the multilayer structure
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Application No.: US15556150Application Date: 2016-03-18
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Publication No.: US10589493B2Publication Date: 2020-03-17
- Inventor: Ryohei Komuro
- Applicant: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-054224 20150318; JP2015-069631 20150330
- International Application: PCT/JP2016/058652 WO 20160318
- International Announcement: WO2016/148271 WO 20160922
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B32B27/08 ; B65D65/40 ; B32B27/28 ; C08L29/04 ; C08K5/098 ; B65D81/24 ; B32B27/18 ; B32B21/08 ; B32B27/36 ; B32B27/10 ; B32B29/00 ; B32B15/08 ; B32B5/02 ; B32B27/34 ; B29C48/16 ; B32B7/12 ; B32B27/20 ; B32B27/30 ; B32B27/32 ; B65D65/16 ; C08J5/12 ; B29C48/08 ; B29C48/21 ; B29K23/00 ; B29K105/00 ; B29K509/00 ; B29L31/00

Abstract:
A multilayer structure is provided, which includes a layer containing a saponified ethylene-vinyl ester copolymer, and a layer of a thermoplastic resin other than the saponified ethylene-vinyl ester copolymer provided on at least one side of the saponified ethylene-vinyl ester copolymer-containing layer with the intervention of an adhesive resin layer. An interface layer having a thickness (X) of 50 to 400 nm is present in an interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer. Alternatively, a viscosity increase rate in the interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer is 0.1% to 8%. Therefore, the multilayer structure has long-run durability, and is less liable to have poor appearance even if being produced by a multilayer coextrusion method.
Public/Granted literature
- US20180043664A1 MULTILAYER STRUCTURE, AND PACKAGING MATERIAL FORMED FROM THE MULTILAYER STRUCTURE Public/Granted day:2018-02-15
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