Invention Grant
- Patent Title: Modular enclosed transportation structure and integrated track assembly
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Application No.: US15820663Application Date: 2017-11-22
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Publication No.: US10589756B2Publication Date: 2020-03-17
- Inventor: Ali Zarafshan
- Applicant: Hyperloop Technologies, Inc.
- Applicant Address: US CA Los Angeles
- Assignee: HYPERLOOP TECHNOLOGIES, INC.
- Current Assignee: HYPERLOOP TECHNOLOGIES, INC.
- Current Assignee Address: US CA Los Angeles
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: E01B29/32
- IPC: E01B29/32 ; E01B2/00 ; E01B25/00 ; E01B25/30 ; B61B13/10 ; B61B13/08

Abstract:
A modular structure, configured to be connectable with a plurality of modular structures to form an enclosed transportation path, each modular structure including a bottom element structured and arranged to provide a track support surface and a plurality of upper element attachment structures, and an upper element configured to attach to the bottom element at the plurality of upper element attachment structures, wherein the upper element is structured to sealingly engage with the lower element.
Public/Granted literature
- US20180141571A1 MODULAR ENCLOSED TRANSPORTATION STRUCTURE AND INTEGRATED TRACK ASSEMBLY Public/Granted day:2018-05-24
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