Invention Grant
- Patent Title: Optical interconnect modules with 3D polymer waveguide
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Application No.: US15963043Application Date: 2018-04-25
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Publication No.: US10591687B2Publication Date: 2020-03-17
- Inventor: Abraham Jou , Paul Mao-Jen Wu
- Applicant: ADOLITE INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADOLITE INC.
- Current Assignee: ADOLITE INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Alston & Bird LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01S5/183 ; H05K1/02 ; G02B6/122 ; G02B6/12 ; H04B10/25 ; H04B10/67 ; G02B6/36 ; H01S5/022 ; H05K1/18 ; H04B10/50 ; H04J14/02

Abstract:
An optical interconnect structure connecting a VCSEL laser or a photodetector to a fiber cable with a 3D polymer waveguide is described. The waveguide has a vertical portion at one end of a horizontal trench portion joined by a 45 degree sidewall. The vertical portion interfaces with VCSEL laser arranged on a flexible circuit board. The other end of the horizontal trench portion connects to a fiber via a mechanical transport connector. The flexible structure also holds driver, receiver, pad, amplifier, RF chip and transmission lines. A method of fabrication includes: patterning a polymer cladding layer into a horizontal trench and a 45 degree side wall by applying multiple exposure techniques; filling horizontal trench and 45 degree side wall cavity to form a core followed by planarizing the core layer to remove excess core; patterning a vertical cavity aligned with the 45 degree side wall to form a reflector.
Public/Granted literature
- US20180335584A1 OPTICAL INTERCONNECT MODULES WITH 3D POLYMER WAVEGUIDE Public/Granted day:2018-11-22
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