Photocurable composition, and methods using the same for forming cured product pattern and for manufacturing optical component, circuit board and imprinting mold
Abstract:
A photocurable composition contains a polymerizable compound (A) satisfying OA=NA/(NC,A−NO,A), wherein NA, NC,A and NO,A represent the total number of atoms, the number of carbon atoms, and the number of oxygen atoms, respectively, in (A); and a non-polymerizable component (E) containing at least one compound (X) including a photopolymerization initiator (B), in a proportion of 10% to 50% relative to the total weight of (A) and (E). The component (E) has a weight average molecular weight of 250 or less. The compound (X) satisfies OX=NX/(NC,X−NO,X). NX, NC,X and NO,X represent the total number of atoms, the number of carbon atoms, and the number of oxygen atoms, respectively, in the corresponding compound (X). The composition satisfies: OA−OE>1.00; and OAE
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