Invention Grant
- Patent Title: Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
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Application No.: US15341843Application Date: 2016-11-02
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Publication No.: US10593584B2Publication Date: 2020-03-17
- Inventor: Brent Donald Alfred Elliot , Frank Balma , Michael Parker , Jason Stephens , Guleid Hussen
- Applicant: Component Re-Engineering Company, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Component Re-Engineering Company, Inc.
- Current Assignee: Component Re-Engineering Company, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Michael A. Guth
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683 ; B23Q3/15 ; B23K1/00 ; C04B37/00 ; H01L21/687 ; B23K1/19 ; B23K1/20 ; B23K1/008 ; B23K103/18 ; B23K103/00 ; B23K101/42
Abstract:
An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C. to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C. to 750 C.
Public/Granted literature
- US20170263486A1 Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same Public/Granted day:2017-09-14
Information query
