Invention Grant
- Patent Title: Substrate treatment apparatus
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Application No.: US16080763Application Date: 2017-02-27
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Publication No.: US10593587B2Publication Date: 2020-03-17
- Inventor: Hiroshi Abe , Toyohide Hayashi , Kenji Kobayashi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2016-067177 20160330
- International Application: PCT/JP2017/007462 WO 20170227
- International Announcement: WO2017/169435 WO 20171005
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01L21/02

Abstract:
A substrate processing apparatus includes a spin base on which a chuck member that holds a peripheral edge of a substrate is disposed, a motor which rotates the spin base, a heater unit which is positioned between the substrate held by the chuck member and an upper surface of the spin base, a processing liquid supply unit which supplies a processing liquid toward a surface of the substrate held by the chuck member, and a microwave generating unit which generates microwaves to a lower surface of the substrate from the heater unit. The microwave generating unit may include a microwave generating member which includes a waveguide disposed in the heater unit, microwave oscillator which is disposed outside the heater unit and a coaxial cable which connects the waveguide to the microwave oscillator.
Public/Granted literature
- US20190096737A1 SUBSTRATE TREATMENT APPARATUS Public/Granted day:2019-03-28
Information query
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