Invention Grant
- Patent Title: Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
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Application No.: US15923516Application Date: 2018-03-16
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Publication No.: US10593603B2Publication Date: 2020-03-17
- Inventor: Keisuke Izumi , Naomi Matsuda
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Addison
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Addison
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; B24B37/015 ; H01L21/321 ; B24B37/04 ; H01L21/768
Abstract:
A chemical mechanical polishing apparatus includes a liquid filled bladder that exerts force on the back of the substrate being polished. The bladder can be a multi-chamber bladder having chambers filled with different ratios of hot and cold water. Eddy current detection during the polishing can be used to control the polishing process parameters.
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