Invention Grant
- Patent Title: Semiconductor apparatus and method of manufacturing the same
-
Application No.: US16117102Application Date: 2018-08-30
-
Publication No.: US10593789B2Publication Date: 2020-03-17
- Inventor: Kenji Suzuki , Mitsuru Kaneda , Koichi Nishi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2017-191043 20170929
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/10 ; H01L21/265 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L29/36 ; H01L29/40

Abstract:
A semiconductor apparatus includes a semiconductor substrate including a semiconductor device. The semiconductor device includes a first n-type buffer layer, a second n-type buffer layer, and a first p-type semiconductor region. A first maximum peak concentration of first n-type carriers contained in the first n-type buffer layer is smaller than a second maximum peak concentration of second n-type carriers contained in the second n-type buffer layer. The first p-type semiconductor region is formed in the first n-type buffer layer. The first p-type semiconductor region has a narrower width than the first n-type buffer layer.
Public/Granted literature
- US20190103479A1 SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-04-04
Information query
IPC分类: